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Optical EchoProbe 413光學(xué)反射探針
Latest Optical Technique
最新的光學(xué)技術(shù)
Ideal solution for Wafer Backgrind and Etch Thickness Gauging on Si, GaAs or III-Vs, non-conducting materials like Glass, Tape
硅片背面研磨蝕刻厚度測(cè)量最理想方案用于Si, GaAs或者III-Vs,非導(dǎo)電材料比如玻璃，膠帶
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Optical EchoProbe Technology光學(xué)反射探針技術(shù)
Low Coherence Interferometry (other than classical interferometry) is suitable for rough surfaces even in the case of speckle imaging. This makes it interesting for industrial use.
低相干干擾量度法（不同于傳統(tǒng)的干擾量度法）適用于粗糙表面，甚至是斑點(diǎn)圖象。這另它適用于工業(yè)使用。
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Fiber-optic implementation of Michelson interferometer LS with low coherence light source
低凝聚光源的邁克爾遜干涉儀光纖啟用
Light source:光源
Superluminescent broad band Diode Center Wavelength 1315 nm
Bandwidth >50 nm超發(fā)光寬頻二極管中心波長(zhǎng)1315nm頻寬>50nm
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Optical EchoProbe Technology: Measured Signal
光學(xué)反射探針技術(shù)：測(cè)量信號(hào)
When optical lengths of reference beam path and sample beam path are
equal then Interference signal is observed
當(dāng)參考光束路徑和式樣光束路徑光程長(zhǎng)等同時(shí)，觀測(cè)干擾信號(hào)
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Bare Si Wafer裸硅片
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Wafer with Tape膠帶硅片
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Silicon Wafer with Metal Layer and Tape金屬層和膠帶硅片
Solution: Dual Probe Head for non-transparent samples
方法：不透明樣例，雙探針頭
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Vibration in-sensitive Setup振動(dòng)感應(yīng)裝置
thermal drift eliminated消除熱飄移
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●Synchronized Low ?Coherence Michelson Dual ?Interferometer干擾邁克爾遜雙干擾儀
●Arrangement of two Probe Heads with synchronized low coherence dual interferometer in configuration
調(diào)整已經(jīng)同步的干擾邁克爾遜雙干擾儀兩個(gè)探針頭
●optimized for reduction of vibration noise
最大的減少振動(dòng)噪聲
W-Wafer, M-Mirror, MI-Michelson Interferometer, TMS moving stage/scanning mirror
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Comparison of Single and Dual Probe Interferometry
單/雙探針干擾量度法比較
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● Single ?probe system samplerequirements單探針系統(tǒng)樣本要求
– ?Smooth surfaces, homogenousmaterials光滑表面，材料均勻
–? Transparent substrate material透明基板材料
–? Known refractive indices已知的折射指數(shù)
●Dual probe system providessolution for雙探針系統(tǒng)適用
– Nontransparent samples
– Samples with unknown refractive indices
–非透明樣本
–未知折射指數(shù)
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Applications應(yīng)用
●Wafer Thickness and TTV硅片厚度和TTV
●Topography構(gòu)狀
●Strained wafers已變形的硅片
●Profile depth輪廓深度
●Measurement of Tape膠帶測(cè)量
●Warp翹曲
●Bump Height凸起高度
●Ultra Fast Measurements超快速測(cè)量
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