![華林科納半導(dǎo)體--單片清洗機(jī)]( "華林科納半導(dǎo)體--單片清洗機(jī)")
單片清洗機(jī)在安裝調(diào)試的過(guò)程中，會(huì)遇到一些常見(jiàn)問(wèn)題，華林科納CSE的安裝技術(shù)工程師也整理了如下注意事項(xiàng)，可供大家參考:機(jī)械部分1.設(shè)備結(jié)構(gòu)主要分為：設(shè)備殼體，中間選轉(zhuǎn)部分，四周擺臂部分，后部滾刷部分，設(shè)備管路系統(tǒng)，供酸系統(tǒng)；2.中間選轉(zhuǎn)部分在安裝時(shí)，要保證安裝完成后，中間旋轉(zhuǎn)部分的高度可以調(diào)節(jié)，真空壓力要保證好，防止旋轉(zhuǎn)時(shí)及進(jìn)行滾刷時(shí)把片子轉(zhuǎn)飛掉，在腐蝕清洗時(shí)，要保證有一定的轉(zhuǎn)速，藥液從片著四周出去，防止污染片子背面；3.四周擺臂機(jī)構(gòu)，根據(jù)工藝要求每個(gè)擺臂上面的藥液和噴頭也不一樣，工藝制作時(shí)，根據(jù)藥液來(lái)選擇擺臂，擺臂設(shè)計(jì)時(shí)，因?yàn)橛行┧幰河袦囟纫螅瑪[臂應(yīng)該藥液預(yù)熱或者預(yù)冷位置，讓藥液進(jìn)行預(yù)熱或者預(yù)冷，同時(shí)不會(huì)噴到片子上面，擺臂還有擺動(dòng)噴灑藥液的供液，擺動(dòng)的幅度和擺動(dòng)的范圍都是要可以調(diào)整的；4.后部滾刷部分，在整個(gè)機(jī)構(gòu)組裝安裝完成之后，擺動(dòng)的高度也是可以進(jìn)行上下調(diào)整的，滾刷伸出和縮回的距離也應(yīng)該可以進(jìn)行設(shè)定，因?yàn)闈L刷的材料是PVA的，用之前是進(jìn)行真空包裝，安裝之后，要每隔10秒滾刷進(jìn)行滾動(dòng)，滾動(dòng)同時(shí)上面要進(jìn)行噴水，不然滾刷就會(huì)變硬；5.旋轉(zhuǎn)，擺動(dòng)，滾刷，根據(jù)工藝的不同，可以進(jìn)行選擇，然后進(jìn)行不同的組合。電器部分1.在制作程序時(shí)，有要求設(shè)定參數(shù)時(shí)，都應(yīng)該設(shè)有該參數(shù)的最大值和最小值，讓用戶在范圍內(nèi)進(jìn)行設(shè)定，防止發(fā)生錯(cuò)誤；2.因?yàn)閱纹瑱C(jī)的藥液溫度要求較高，所以制作程序時(shí)要考慮藥液預(yù)熱和預(yù)冷的...
發(fā)布時(shí)間:
2018
-
01
-
02
瀏覽次數(shù)：875
華林科納主要通過(guò)偏心旋轉(zhuǎn)改善蝕刻均勻度以及斜度，通過(guò)精準(zhǔn)的溫度控制及時(shí)間調(diào)節(jié)定位蝕刻深度更多的相關(guān)設(shè)備調(diào)試視頻可以關(guān)注華林科納CSE官網(wǎng)（http://wxyzlgp.cn），現(xiàn)在熱線咨詢400-8768-096可立即獲取免費(fèi)的半導(dǎo)體清洗解決方案。
發(fā)布時(shí)間:
2018
-
01
-
02
瀏覽次數(shù)：373
SOLAR SIMULATOR SIMULATORMODEL # SS150AAA太陽(yáng)能模擬器型號(hào) SS150AAAFEATURES 性能 TECHNICAL SPECIFICATIONS 技術(shù)參數(shù)
發(fā)布時(shí)間:
2016
-
03
-
24
瀏覽次數(shù)：271
EchoProbe SOFTWARE反射探針軟件setup of Recipes,Data logging,Real time Display 設(shè)置菜單，數(shù)據(jù)記錄，實(shí)時(shí)顯示 EchoProbe SOFTWARE反射探針軟件Programable Data Points and Patterns, Variety of Displays可控?cái)?shù)據(jù)點(diǎn)，模式，顯示種類 Presentation of Results結(jié)果陳列 Advantages of Optical EchoProbe光學(xué)反射探針優(yōu)勢(shì)? Can measure Si or III/V wafers with or without tape, with Film frame, bumped wafers, bonded wafer - with Si or Glass or Sapphire carriers.可測(cè)量膠帶及Si或者III/V裸硅片，帶薄膜框架，凸起硅片，Si或者玻璃粘合硅片? Not affected by tape thickness, adhesives, pattern structures or non conducting materials不受膠帶厚度，粘合劑，圖案結(jié)構(gòu)或者不導(dǎo)電材料影響? Non contact tec...
發(fā)布時(shí)間:
2016
-
03
-
24
瀏覽次數(shù)：297
Wafer and Membrane Thickness, Warp, TTV硅片和薄膜厚度，彎曲，TTVOptical EchoProbe光學(xué)反射探針 Outline概要? Introduction簡(jiǎn)述? Measurement Requirements for Wafer Thinning硅片減薄測(cè)量要求? Discussion of different approaches for Wafer Thickness Measurement硅片厚度檢測(cè)不同方法的討論? Optical EchoProbe for Wafer Thickness Measurement光學(xué)反射探針的硅片厚度檢測(cè)? Applications應(yīng)用 – Thickness and Warp after Grinding, Etching研磨，蝕刻后的厚度和翹曲 – Measurement of stacks of non- and semiconducting materials (MEMS) –半導(dǎo)體材料（MEMS)的堆疊檢測(cè)? Configur...
發(fā)布時(shí)間:
2016
-
03
-
24
瀏覽次數(shù)：388
Bump Height Measurement凸起高度測(cè)量 Ultra Fast Measurements (UF 800)超快速測(cè)量? Acquisition time of 125 μs accomplished with High Speed reference mirror and optical encoder? 高速參考反射鏡和光編碼器使設(shè)備僅需125 μs采集時(shí)間? Ideal solution for measurement on spinning wafers旋轉(zhuǎn)硅片測(cè)量的理想方法? Pressurized enclosure for measurement in challenging environments高壓密閉檢測(cè) ? Software and hardware interface for customizitation/OEM按客戶需求訂制軟件和硬件界面 413 Optical EchoProbe光學(xué)反射探針Overview about Configurations結(jié)構(gòu)綜述413EC (Manual System手動(dòng)系統(tǒng))413-200 (Semiautomated system –m...
發(fā)布時(shí)間:
2016
-
03
-
24
瀏覽次數(shù)：302
Long Distance Measurement長(zhǎng)距離測(cè)量 Topography of a strained Wafer w/ Film on Topw已變形硅片構(gòu)形/頂部有薄膜 Real World Samples實(shí)際樣例Mounted Wafers on Elastic Tapes硅片置于橡皮圈膠帶上 Inhomogeneous tapes heavilyscatter light, and complicate measurements不均勻的膠帶使燈光散開(kāi)，使測(cè)量復(fù)雜化(distance between text and tape is Warp Measurement翹曲檢測(cè)? Warp翹曲: 101.86? Bow弓起 44.68
發(fā)布時(shí)間:
2016
-
03
-
24
瀏覽次數(shù)：491
Applications應(yīng)用? Wafer Thickness and TTV硅片厚度和TTV? Topography構(gòu)狀? Strained wafers已變形的硅片? Profile depth輪廓深度? Measurement of Tape膠帶測(cè)量? Warp翹曲? Bump Height凸起高度? Ultra Fast Measurements超快速測(cè)量 Warp and Dam Thickness?翹曲和壩厚度 Dam Thickness壩厚度 Warp翹曲 Measurement of Wafer Topography硅片圖形測(cè)量? wafer topography and thickness using EchoprobeTechnology.硅片圖形和厚度用回射探針技術(shù)? Values on iso-lines are expressed inμm Wafer is concave in the middle.iso線的測(cè)量值是以u(píng)m表示的，硅片中間是凹的 Measurement of Profile Depth輪廓厚度測(cè)量High Aspect Rat...
發(fā)布時(shí)間:
2016
-
03
-
24
瀏覽次數(shù)：442
Introduction to 128, 128L, 128LC2C Product Line for Film Stress Measurement128 128L 128LC2C薄膜應(yīng)力測(cè)試產(chǎn)品簡(jiǎn)介128, 128L, 128C2C Product Line Introductions介紹? Product Pictures產(chǎn)品圖片? Basic principles of 128 Line 128產(chǎn)品系列基本原理? Film Stress薄膜應(yīng)力? Dual laser scanner雙激光掃描? Stoney equation for film stress薄膜應(yīng)力Stoney方程式? Who needs the products?誰(shuí)需要這種產(chǎn)品？? Film property monitor and/or R&D薄膜性能監(jiān)測(cè)及研發(fā)? What are the simple specifications?什么是基本參數(shù)？? Film stress range / reproducibility薄膜應(yīng)力范圍/可再生性 128 Film Stress and Flatness Measurement Models ( Room Temperature )薄膜應(yīng)力和平整度測(cè)試設(shè)備（室溫） Film Stress & Wafer Yi...
發(fā)布時(shí)間:
2016
-
03
-
23
瀏覽次數(shù)：1361
Optical EchoProbe 413光學(xué)反射探針Latest Optical Technique最新的光學(xué)技術(shù)Ideal solution for Wafer Backgrind and Etch Thickness Gauging on Si, GaAs or III-Vs, non-conducting materials like Glass, Tape硅片背面研磨蝕刻厚度測(cè)量最理想方案用于Si, GaAs或者III-Vs,非導(dǎo)電材料比如玻璃，膠帶 Optical EchoProbe Technology光學(xué)反射探針技術(shù)Low Coherence Interferometry (other than classical interferometry) is suitable for rough surfaces even in the case of speckle imaging. This makes it interesting for industrial use.低相干干擾量度法（不同于傳統(tǒng)的干擾量度法）適用于粗糙表面，甚至是斑點(diǎn)圖象。這另它適用于工業(yè)使用。Fiber-optic implementation of Michelson interferometer LS with low coherence light source 低凝聚光源的邁克...
發(fā)布時(shí)間:
2016
-
03
-
23
瀏覽次數(shù)：461